Working principle of the spin coater

The working principle of the spin coater is to inject various glue liquids on a high-speed rotating substrate, and use centrifugal force to uniformly coat the glue liquid on the substrate. The main application areas are surface coating processes such as semiconductors, silicon wafers, wafers, substrates, conductive glass and plate making. The working parameters of the homogenizer used in the laboratory are mainly the coating rate, the coating time, etc. The main purpose of the coating rate is to control the uniformity of the film, and the main purpose of the coating time is to control the thickness of the film. But the experiment shows that the film thickness depends on the viscosity coefficient between different glues and substrates, and is also related to the rotation speed and time.