Technical Articles
The method of preparing molybdenum disulfide/carbon composite fibers with an Electrospinning machine: Weigh 1.5 g PAN and 1.5 g ATTM, add them to 8.0 g DMF solvent, and stir at constant temperature for 12 hours to obtain a reddish-brown viscous solution
The working principle of the spin coater is to inject various glue liquids on a high-speed rotating substrate, and use centrifugal force to uniformly coat the glue liquid on the substrate. The main application areas are surface coating processes such as semiconductors, silicon wafers, wafers, substrates, conductive glass and plate making
Where is the compound formed in the process of forming the compound from the metal target surface through the reactive sputtering process? Since the reactive reaction gas particles collide with the target surface atoms to produce a chemical reaction to generate compound atoms, which is usually an exothermic reaction, the heat generated by the react
Target poisoning means that the target has reacted and the composition has changed. For example, in the process of TiN, the Ti target reacts with N2 to generate TiN. After the process is completed, there is a layer of TiN on the surface of the Ti target. We call this phenomenon target poisoning
In the 1960s, radio frequency glow discharge was used to prepare thin films of any material from conductors to insulators, so it became popular in the 1970s. DC sputtering is an effective method for making thin films using metal and semiconductor targets. However
Magnetron sputtering includes many types. Each has different working principles and application objects. But there is one thing in common: the interaction between the magnetic field and the electrons makes the electrons spiral around the surface of the target material, thereby increasing the probability of electrons hitting the argon gas to produce
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