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PECVD system for deposition of thick SiOx Ge-SiOx filmsPECVD system for deposition of thick SiOx Ge-SiOx filmsPECVD system for deposition of thick SiOx Ge-SiOx films

PECVD system for deposition of thick SiOx Ge-SiOx films

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Plasma -enhanced chemical vapor deposition (PECVD) is a type of chemical vapor deposition characterized by the use of plasma activation at low temperatures to enhance the chemical vapor deposition reaction. The advantages of this method are that the deposition temperature is low, the deposition rate is fast, and the film produced has excellent electrical properties, good substrate adhesion and excellent step coverage.

 

PECVD vapor deposition application areas:

Plasma enhanced CVD systems can be used in: graphene preparation, sulfide preparation, nanomaterials preparation and other test sites. A variety of films such as    SiOx, SiNx, amorphous silicon, microcrystalline silicon, nano -silicon, SiC, diamond-like, etc. can be deposited on the surface of flake or similar shape samples, and P -type and N-type doped films can be deposited. The deposited film has good uniformity, compactness, adhesion and insulation. Widely used in cutting tools, high-precision molds, hard coatings, high-end decoration and other fields, PECVD vapor deposition  has a wide range of applications in ultra -large scale integrated circuits, optoelectronic devices, MEMS and other fields.


Technical parameters:


Model number

CY-PECVD-200SST


Cavity size

Phi 500 -


Warm zone length

200


Rf power supply

500W-


Temperature

1000    ℃


Pump for forestage

Molecular pump set


Display type

T


Warm zone

I-


Water cooler

CW5200


Cavity material

SS


Sample       heating

Heating temperature

Above     RT-1000℃,   temperature   control     accuracy:   ±1C,   using temperature control meter for   temperature control;

Adjustable speed: 1-20rpm adjustable


Spray head size

Φ90mm, the electrode  spacing    between the spray head and the sample 40-100mm  online continuous adjustable (can  be adjusted according to the process), and   with a ruler index display


Sample Table

200mm diameter


Working vacuum for deposition

0.133-133Pa (can be adjusted according to   process)


Top flange

It can be lifted by motor, the substrate   is easy to change, and there is a visual port

Substrate Table

Linear and azimuth motion of the   substrate table, substrate heating and temperature control, mounting table   and touch screen control, substrate linear motion is manually controlled, and   substrate rotation is controlled by DC motors


Vacuum chamber

Front door opening type,  φ500mm X 500mm stainless steel


Observation window

φ100mm with baffle


Mass flowmeter

Six way mass flow meter


Number paths of gas

Six paths


Pressure range

0.15 Mpa to 0.15 Mpa


Range

0 to 100 SCCM (oxygen)

0 to 100 SCCM (CF4)

0 to 200 SCCM (SF6)

0 to 200 SCCM (argon)

0 to 500 SCCM (other gases air)

0-500 SCCM (other gases nitrogen)


Flow control range

Plus or minus 1.5%


Gas path material

304 stainless steel


Pipe joint

6.35mm bushing joint


Vacuum system

Front pump: oil-free vacuum pump 4.7L/S

Molecular pump: 1200L/S


Measuring range

1 x 10-5 to 1 x 105Pa


Measurement accuracy

1 x 10-5 ~ 1 x 10-4Pa±40% reading

1 x 10-4 ~ 1 x 105Pa for a reading of   ±20%



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  • E-mail: cysi@cysi.wang
  • Tel: +86 371 5519 9322
  • Fax: +86 371 8603 6875
  • Add: No. 820, 8th Floor, 1st Unit, 9th Block, Cuizhu Street, High-Tech Zone, Zhengzhou, Henan, China




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