Home > Products > Plasma Cleaner
integrated circuit chip vacuum Plasma Cleanerintegrated circuit chip vacuum Plasma Cleanerintegrated circuit chip vacuum Plasma Cleanerintegrated circuit chip vacuum Plasma Cleaner

integrated circuit chip vacuum Plasma Cleaner

    Vacuum plasma cleaning machine suitable for printed circuit board industry, semiconductor IC field, silicone, plastic, polymer field, automotive electronics industry, aviation industry, etc. Printed circuit board industry: activation of the surface of high-frequency boards, surface cleaning of multilayer boards, de-drilling stains, surface cleaning of soft boards and rigid-flex board, de-drilling stains, activation of soft boards before reinforcement. Semiconductor IC field: COB, COG, COF, ACF process, used for cleaning before wire bonding and welding; silica gel, plastic, polymer field: surface roughening, etching, and activation of silica gel, plastic, and polymer.



Large processing space, increase processing capacity, adopt PLC + touch screen control system, accurately control equipment operation;

The capacity and number of layers of the equipment cavity can be customized according to customer requirements to meet customer needs; maintenance and repair costs are low, which is convenient for customer cost control;

High precision, fast response, good controllability and compatibility, perfect functions and professional technical support.

integrated circuit chip vacuum Plasma Cleaner

 

Vacuum Plasma Cleaner Scope of application:

Vacuum plasma cleaning machine suitable for printed circuit board industry, semiconductor IC field, silicone, plastic, polymer field, automotive electronics industry, aviation industry, etc. Printed circuit board industry: activation of the surface of high-frequency boards, surface cleaning of multilayer boards, de-drilling stains, surface cleaning of soft boards and rigid-flex board, de-drilling stains, activation of soft boards before reinforcement. Semiconductor IC field: COB, COG, COF, ACF process, used for cleaning before wire bonding and welding; silica gel, plastic, polymer field: surface roughening, etching, and activation of silica gel, plastic, and polymer.

Vacuum Plasma Cleaner Parameters:


Name

Vacuum   plasma processing system

Model

CRF-VPO-8L-S

Control   system

PLC+touch   screen

Power   supply

380V/AC,50/60Hz,   3kw

RF   Power

600W/13.56MHz



Volume

80L(Option)

Electrode   of plies

8(Option)

Area

400(L)*300(W)(Option)

Gas

Two   working gas options: Ar, N2, H2, CF4, O2

Appearance

Sheet   metal structure


Contact Us
  • E-mail: cysi@cysi.wang
  • Tel: +86 371 5519 9322
  • Fax: +86 371 8603 6875
  • Add: No. 820, 8th Floor, 1st Unit, 9th Block, Cuizhu Street, High-Tech Zone, Zhengzhou, Henan, China




Follow Us

Copyright © Zhengzhou CY Scientific Instrument Co., Ltd. All Rights Reserved    Update cookies preferences

| Sitemap |       Technical Support: