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four target magnetron sputtering coater instrument for conductive filmfour target magnetron sputtering coater instrument for conductive filmfour target magnetron sputtering coater instrument for conductive filmfour target magnetron sputtering coater instrument for conductive filmfour target magnetron sputtering coater instrument for conductive film

four target magnetron sputtering coater instrument for conductive film

    The four target magnetron sputtering coating instrument can be used to prepare single or multi- layer ferroelectric film, conductive film, alloy film, semiconductor film, ceramic film, dielectric film, optical film, oxide film, hard film, polytetrafluoroethylene film

Four-target   magnetron   sputtering   coater    is   a   cost-effective    magnetron sputtering   coater independently  developed  by  our  company,  which  has  the characteristics  of  standardization, modularization and customization. The magnetron target has a choice of 1 "2", customers can choose according to the size of the plated substrate; The power supply is 500W DC power supply and 500W RF power supply, DC power supply can be used for the preparation of metal film, RF power supply can be used for the preparation of non-metal film, three targets can meet the needs of multi-layer or multiple coatings. If customers have other coating needs, you can customize other RF power supply and pulse power supply, each type of power supply has a variety of specifications from 300W to 1000W.

The coating instrument is equipped with two high-precision mass flowmeters. If customers have other needs, they can customize the gas path of up to four mass flowmeters to meet the needs of complex gas environment construction; The instrument is equipped with advanced turbomolecular pump group, the limit vacuum can reach  1.0E-5Pa, and other types of molecular pumps are available for purchase. The gas route of the molecular pump is controlled by multiple solenoid valves, which can realize that the chamber can be opened and the sample can be taken out without the pump, which greatly improves your work efficiency. This product can be selected as an industrial computer to control the system, in the computer program can achieve the control of the vacuum pump group, sputtering power supply control and other most functions, can further improve your experimental efficiency.

The four target magnetron sputtering coating instrument can be used to prepare single or multi- layer ferroelectric film, conductive film, alloy film, semiconductor film, ceramic film, dielectric film, optical film, oxide film, hard film, polytetrafluoroethylene film and so on. Compared with similar equipment, the three-target magnetron sputtering coateris not only widely used, but also has the advantages of small size and easy operation. It is an ideal equipment for preparing material films in the laboratory

Coating      vacuum

system

 

Vacuum

assembly

60m3/h    mechanical  pump  and    KYKY1600L  molecular

pump to form the pumping system and   equipped with high- precision     composite   vacuum   gauge     to   measure   and monitor the vacuum degree in realtime;

 

Pumping time

After the system is exposed to the   atmosphere for a short time and filled with dry nitrogen, then pumping   begins. The  vacuum   degree    is  less  than     5×10-4Pa  within   30 minutes, and the vacuum degree is less   than 5Pa after the system stops pumping and shuts down for 12 hours;

Ultimate

vacuum

≤6×10-5Pa

Valve

assembly

Pre-extraction valve DN40, electric main   valve CF200, DN16  vent  valve,     DN40  solenoid  valve     and  various vacuum  lines,    etc.  (the  above    valves  are  pneumatic    or electric)

Vacuum

automatic

constant

pressure

The equipment can quickly reach the high   vacuum, and can be automatically adjusted in real time when the required   vacuum degree is reached after the process air intake, so as to maintain a   stable vacuum degree, reduce the process to a high degree, and ensure the   repeatability of the prepared sample.

Magnetron

sputtering

generation       and control     reaction system

Coating

chamber limit vacuum

≤6×10-5Pa; System vacuum leak detection   rate: ≤8.0×10-7 Pa.l/S

Vacuum

chamber size

500 x 500 x 420mm,

Gas type

Argon, nitrogen, hydrogen, oxygen

Substrate size as    well      as functional

components

Substrate sizes of Φ4 inches (compatible   with small sizes) can  be  placed;     Substrate  rotation  range     5~60  RPM adjustable;   Substrate     heating   temperature   600±1℃, controlled by thermocouple   closed-loop feedback (i.e. PID temperature control)

Cooling

method

Water cooling

Sputter deposition and control system

Control

system

PLC+ PC software coating machine control   system

Constant pressure  working    intake

of air

 

Use a thin film vacuum gauge for   measurement

Measuring

range

3 Pa 0.013 Pa

Target     number

size,

4 2-inch sputter targets

Target

Spacing

The four targets are sputtered vertically   upward, and the distance between the target and the sample is adjustable

 

Power Supply

2 sets of 500W RF sputtering power supply   (automatic matching), 2 sets of 500W DC sputtering power supply, 1 set of   500W bias power supply (improve the density and uniformity of the film layer,   and have sputtering cleaning function)

Process      air

Intake assembly

2    way  MFC  mass    flow  meter  controls    gas  flow   (0- 100SCCM, 0-200 SCCM), accurate to 0.1   sccm adjustable

 

Evenness

The uniformity of the inner membrane thickness of the 4- inch diameter wafer sample is less   than 3%, and   the error between   the center point and the edge thickness is less than 3%

Other

Supply

voltage

AC220V,50Hz

Overall

dimensions

600mm X 650mm X 1280mm

Machine

weight

350kg

Machine

power

4KW


Contact Us
  • E-mail: cysi@cysi.wang
  • Tel: +86 371 5519 9322
  • Fax: +86 371 8603 6875
  • Add: No. 820, 8th Floor, 1st Unit, 9th Block, Cuizhu Street, High-Tech Zone, Zhengzhou, Henan, China




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