High power DC magnetron sputtering coater is a high power desktop magnetron plasma sputtering coater with a water cooling 2" target head, water chiller and rotatable sample holder. The coating unit is designed for coating all metallic films up to 4" diameter wafer including Zn, Al, Ti and carbon light film at an affordable cost. One Al target is included for immediate use.
High power DC magnetron sputtering coater uses PLC control panel to control the equipment, which is convenient and intuitive to operate.It has a 2-inch water cooling target head and a rotatable sample stage,The water cooling target makes the surface of the sample after coating not deformed due to excessive coating temperature, and even damages the sample; the sample stage can be rotated, and the sample can be rotated while coating to make the surface of the sample uniform after coating. The device is small in size and cost-effective. It is an ideal coating equipment for making various metal films. It can be equipped with various metal targets and vacuum pump.
Input Voltage | 220VAC 50/60Hz ,110 V power is available by using a 1000 W transformer (15 A fuse). |
Output Power |
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Specimen Chamber |
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Sputtering Head &Specimen Stage |
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Control Panel |
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Ultimate Vacuum Pressure |
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Gas Atmosphere |
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Target | One 2" Copper target is included for testing, Target size: 2" Dia.×2.5mm. It also can coat Ag, Al, Cr, Ni, Pt, Ti, Sn, Li, Mg, etc. almost every kind of metallic material. Warning: Aluminum ,Chromium or Nickel Target can be coating by this machine, but please view the Recommend Coating Method before using.Please using RF Plasma Magnetron Sputtering for coating Alumina |
Overall Dimension | L 440 mm×W 330 mm × H 290 mm |
Net Weight | 20 kg |
Warranty | One year limited with lifetime support |
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